Agenda:In-Person Event

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Join the TSMC 2026 Japan Open Innovation Platform Ecosystem Workshop and learn from OIP partners how to leverage their technology for your design challenges!

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Date: Friday, November 6, 2026

Time Plenary Session
08:30 - 09:30 Registration & Ecosystem Pavilion
09:30 - 09:40 Welcome Remarks
09:40 - 10:00 Guest Speech
10:00 - 10:15 TSMC Keynote I
10:15 - 10:40 TSMC Keynote II
10:40 – 11:00 Coffee Break & Ecosystem Pavilion
TSMC Technical Talks
11:00 – 11:30

TSMC

TSMC

OIP Partner Technical Sessions
Advanced Logic & 3D IC Track Analog, RF, Specialty Track
11:00 – 11:25 Scaling AI Data Center’s Infrastructure: Protocol Agnostic Physical Design for Scale-Up using 224G SerDes

Alchip Technologies / Synopsys

Reliability-Aware Analog Design Optimization

Cadence Design Systems

11:25 – 11:50 Scaling up AI Compute, Memory and Connectivity

GUC

PCI Express Solutions for HPC/AI Storage: Benefiting from TSMC’s advanced processes

Cadence Design Systems / SK hynix

11:50 – 12:15 Methodology for Fmax-per-Watt Scaling in CPU-Centric Designs Using Advanced EDA and DTCO Techniques

Synopsys / Qualcomm Technologies

AI-Powered RF Design Migration Flow for Transition from TSMC’s N6RF+ to N4P Process Node

Keysight Technolgies / Synopsys

12:15 – 13:00 Lunch & Ecosystem Pavilion
13:00 – 13:25 A Distributed and Scalable Dynamic Power Integrity Flow from Early Analysis to Sign-off for Large-Scale SerDes Designs

Synopsys / Sanechips Technology

Production-Quality Memory IP Signoff at Scale: A NXP and Siemens EDA Joint Deployment of Solido IP Validation Suite on TSMC Automotive Nodes

Siemens EDA / NXP Semiconductors

13:25 – 13:50 From Design to Mass Production: GUC and FuriosaAI’s Joint Collaboration on RNGD

GUC / FuriosaAI

Driving Next Gen Memory Interfaces: LPDDR6/5X combo subsystem for High Bandwidth, Low Latency with Optimum Data Traffic with CPU/GPU/XPU, in Applications such as AI, Cyber security, Datacenter, and Automotive

Innosilicon / Axiado

13:50 – 14:15 A Scalable PDN Optimization Methodology for Adaptive Multi-Package Automotive MCUs

Synopsys / NXP Semiconductors

Accelerate Floorplanning and Rapid Layout Editing with Custom Compiler Smart Floorplanning

Synopsys / Mediatek

14:15 – 14:40 Liberty-Based Profiling for IP Benchmarking

Siemens EDA / NXP

Catching SOA Violations in Over-Voltage-Tolerant (OVT) GPIOs on Advanced FinFET Nodes

Sofics / Siemens EDA

14:40 – 15:00 Automated Architecture-Phase PDN Prototyping Workflow to Advance Multi-Die Designs

Synopsys / Mediatek

TSMC 22ULL MRAM for Automotive MCU Applications

tsmc / Semidrive

15:00 – 15:30 Coffee Break & Ecosystem Pavilion
15:30 – 17:30 Tutorial Ⅰ: Advanced Node Digital Flow & Intro to 3DFabric

TSMC

Tutorial Ⅱ: Analog/RF Design & Migration

TSMC

17:30 – 18:30 Closing Reception & Raffle

*The agenda is subject to change by TSMC.