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Analog, RF, Specialty Track
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A Scalable PDN Optimization Methodology for Adaptive Multi-Package Automotive MCUs
Synopsys / NXP Semiconductors
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Abstract
The proposed methodology was validated on a production automotive MCU supporting multiple packages. Key results include:
• Identification of the worst-case package enabled PDN sign-off coverage for all package variants while reducing PDN sign-off workload by approximately 80%.
• Package-level enhancements using wider bondwires and a ground ring achieved ~10% IR drop improvement in the worst-case package without increasing package or die cost.
• Die-level inner and intra pad optimizations delivered up to ~20% IR drop reduction, while avoiding die size increase and providing measurable wafer cost savings.
• The combined solution accelerated EMIR closure, improved PDN robustness, and supported faster tape-out under tight schedules.
This methodology is especially beneficial for automotive MCU applications requiring high reliability, scalable packaging strategies, and rapid time-to-market. This can be extended to other multi-package SoC designs targeting cost-sensitive and safety-critical markets.
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