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3D IC Track
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Package-Level Thermal Characterization Using Vapor Chamber Lid for High-Power AI/Datacenter Applications
STATS ChipPAC
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Abstract
Beneficial for AI/HPC, datacenter, networking, and automotive customers developing high-power advanced packages such as AI GPUs, XPUs, ASICs, HBM-integrated 2.5D/3D packages, and large FC-BGA platforms.
Vapor chamber (VC) lid solution demonstrated significantly improved hotspot heat dissipation and temperature uniformity, with expected thermal resistance reduction of approximately 10–25% and hotspot temperature reduction of around 5–15°C compared to conventional Cu lid solutions.
Improved thermal performance enables higher package power capability, better system stability, longer product lifetime, and reduced thermal-induced reliability risks for next-generation high-TDP AI applications.
The customized thermal characterization system also enables faster thermal validation, earlier detection of thermal issues, reduced redesign cycles, and potential overall package/system cooling cost reduction through improved thermal efficiency and optimized cooling architecture.
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