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3D IC Track
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Shift-Left Quality Screening for Chiplet-Based Architectures Using Telemetry-Based Analytics
proteanTecs / Amkor Technology
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Abstract
This shift-left methodology enables manufacturers to improve die-level quality, increase confidence in KGD and KGS, reduce downstream quality risk, improve DPPM, and avoid allocating assembly and test resources to material that is flagged as a potential defect. For advanced chiplet-based manufacturing, die-level parametric visibility at wafer sort provides the missing data source for identifying marginal behavior early in the production flow, enabling higher-quality dies to be selected as better candidates for packaging and supporting more robust quality disposition decisions prior to assembly.
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