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3D IC Track 12:00 – 12:20
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Addressing Inter-Die STA Complexity for 3D Multi-Die Designs
Synopsys / Arm
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Abstract
Results to be updated.
Synopsys PrimeTime multi-die STA methodology with HyperScale Ultra delivers significant runtime speedups through model compression and memory reduction, making large AI/HPC 3D designs practical for fast signoff.
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