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3D IC Track 15:30 – 15:50
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Designing with CoWoS S, CoWoS R and CoWoS L: package technology selection and co design for next generation heterogeneous systems
IMEC
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Abstract
IC-link by Imec, Value Chain Aggregator and 3D Fabric Ecosystem Partner of TSMC, provides customers with access to CoWoS-S, CoWoS-R, and CoWoS-L platforms, models, and trade-off analyses, enabling informed platform selection for AI accelerators, CPUs, and heterogeneous compute systems. Through shared development, customers can explore multiple Interposer options without committing prematurely to a sub optimal integration path.
Using the presented methodology, systems with extreme bandwidth requirements have been efficiently mapped onto CoWoS-S, achieving maximal memory proximity and lowest latency. Also, larger multi chip designs have been redirected toward CoWoS-R and CoWoS-L, enabling larger system footprints and improved yield while maintaining sufficient bandwidth and power integrity.
Across demonstrated designs, early platform selection has reduced late stage package redesigns, shortened design cycles, and improved predictability of system level performance and cost. Customers benefit from clearer trade off visibility between performance, scalability, and manufacturability.
Looking ahead, the same selection driven framework extends naturally to future interposer evolutions and advanced nodes such as A14, ensuring that heterogeneous integration remains a scalable and economically viable path for next generation compute systems.
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Legal Notice
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