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3D IC Track 16:10 – 16:30
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From Signal to Thermal: Where HBM Innovation Goes Next
Samsung Memory
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Abstract
With thermal-optimized advanced package technology, HBM can achieve higher bandwidth and provides efficient thermal management at the system level. So we can expect significantly improved AI computing performance while maintaining power efficiency under increasingly dense integration conditions.
The impact of this work extends beyond individual memory devices by providing a scalable memory subsystem foundation for future AI infrastructure. The proposed approach supports continuous AI performance growth across cloud AI, edge AI, and on-device AI environments while enabling more efficient deployment of next-generation AI applications.
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