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3D IC Track
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Comprehensive die-to-system thermal management solutions for advanced 3D IC packaging
Siemens EDA / Asperitas
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Abstract
The proposed methodology demonstrates how the performance and efficiency benefits of advanced packaging and 3D‑IC technologies can be translated into system‑ and facility‑level value, rather than being constrained by late‑stage thermal limitations. By propagating accurate thermal intent from package design through cooling hardware and infrastructure, the workflow enables earlier and more confident architectural decisions.
Key impacts include:
• Improved thermal margin visibility for large‑format, stacked‑die packages, such as x7-x9 reticle size components
• More efficient cold‑plate and CDU designs tailored to true 3D heat‑flux behavior
• Reduced cooling over‑design and lower operational energy consumption
• A quantitative link between silicon‑level innovation and data‑center TCO (Total Cost of Ownership)
By combining detailed thermal analysis, multi‑physics co‑design, and system‑level economics, the collaborative work between Siemens and Asperitas provides a practical framework for ecosystem collaboration across foundry, EDA, and liquid‑cooling technologies. The result is a scalable thermal planning approach that supports the next generation of AI and HPC platforms built on advanced packaging and 3D IC integration.
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