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3D IC Track 14:10 – 14:30
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Broadcom 3DIC STA Signoff with Tempus
Cadence Design Systems / Broadcom
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Abstract
Silicon Proven Data
Presentation outlines results on TSMC-technology multi-billion instance design, running at target speed. Together, these datapoints confirm the entire Tempus 3DIC STA signoff flow works in production.
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Legal Notice
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