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3D IC Track
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Warpage Simulation Fitting, Stress Simulation Method and Glass Core Substrate Application of Advanced Package for AI Chips
Synopsys / Iluvatar CoreX
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Abstract
Furthermore, the warpage mitigation capability of glass core substrates is systematically evaluated using the validated simulation platform. Benefiting from ultra-low CTE, high elastic modulus, and exceptional surface planarity, glass core substrates effectively suppress thermomechanical deformation and enhance assembly stability. Compared with organic substrates, glass core demonstrates pronounced warpage reduction at both reflow peak temperature and room temperature, as validated in a CoWoS-based AI chip package.
The proposed end-to-end thermomechanical solution integrates warpage modeling, closed-loop validation, high-fidelity stress analysis, and advanced material optimization. It provides critical design methodology and engineering guidance for thermomechanical robustness, yield enhancement, and reliability improvement of TSMC CoWoS, FCBGA, and 3D heterogeneous integration platforms.
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