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3D IC Track
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Reference Flow for IVR Stucture: Multi-Die EM/IR, Thermal, and System-Level PI Analysis with Integrated IVR Modeling
Synopsys
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Abstract
The proposed reference flow enables more realistic and scalable analysis for next-generation IVR-based 2.5D and 3DIC systems.
Using the developed Analog-on-Top multi-die EM/IR flow, we successfully demonstrated EM/IR analysis for IVR-in-substrate and IVR-in-interposer architectures with flexible combinations of PMIC, OWL, and DTC structures. The flow enabled integrated analysis across heterogeneous dies and package structures that were previously difficult to evaluate within a unified methodology.
With the enhanced CTM methodology, thermal simulations demonstrated that BEOL-related Joule heating from inductors and metal routing structures can significantly affect overall system thermal distribution. The results showed that ignoring these thermal contributions may underestimate localized hotspot behavior and package-level thermal coupling effects in IVR-integrated systems.
For system-level analysis, the IVR-aware modeling approach enabled realistic evaluation of voltage variation effects during EM/IR and PI simulations. Compared to conventional ideal-source assumptions, the proposed methodology provided improved visibility into voltage droop propagation and transient response behavior affecting downstream SoC and LSI domains.
The reference flow can benefit semiconductor companies developing advanced packaging solutions including:
• AI/HPC systems using advanced 2.5D/3DIC integration
• Mobile SoCs with integrated power delivery architectures
• High-performance computing platforms requiring aggressive power delivery optimization
• Advanced heterogeneous integration platforms using IVR-in-substrate or IVR-in-interposer architectures
The methodology also helps engineering teams identify potential thermal and power integrity issues earlier in the design stage, reducing the risk of late-stage redesign iterations and improving confidence in advanced IVR architecture deployment.
Overall, this work demonstrates a scalable methodology for enabling realistic EM/IR, thermal, and PI analysis in emerging IVR-integrated advanced packaging systems.
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